Electronics Forum | Mon Feb 16 15:47:54 EST 2004 | Jim
I have about 200 PCB's from which a 20mil pitch QFP must be removed, cleaned and re-used (will place them back in trays for the P&P machine to place the parts on new boards). My intitial concern is: how can we remove the parts in an efficient manner?
Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ
What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig
Electronics Forum | Mon Apr 21 17:13:04 EDT 2003 | jonfox
I remember from my days of machine setups that these packages' CAD data is actually off center from where the placement needs to be. Usually CAD center comes up with the parts more to the large collector/ground pad so the the smaller gull wing leads
Electronics Forum | Thu Jan 14 22:52:28 EST 1999 | Wayne
I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some const
Electronics Forum | Thu Sep 25 18:37:36 EDT 2003 | adlsmt
Grind the point on a pogo pin from an in-circuit test fixture flat and push on a leg of the component till it bends, mark the deflection, then add about 30% to the length that the pin pushed in (maybe more if your using no clean and the residue adds
Electronics Forum | Tue Oct 19 09:26:51 EDT 2004 | HOSS
Arman, We introduced wireless wrist straps here on a small scale for safety related jobs such as mass lead trimming. These straps operate by the "Corona" effect which, as it turns out amounts to this: You need to drink a case of that swill to conv
Electronics Forum | Thu Mar 09 16:14:19 EST 2006 | marc
CGO Assuming your system is performing well here are a few ideas to help out your profile.... - Pull the material spec and ensure you are meeting the requirements for times and temp. Many times the material will allow a mild soak of the board prior
Electronics Forum | Tue Oct 17 17:27:08 EDT 2006 | adlsmt
Define "pretty easily". Did anyone ever do whatever is making them fall off now before? In most casses where a component "falls off" then someone implements a totally subjective test to make sure the rest of the parts wont "fall off" they damage a lo
Electronics Forum | Wed Feb 07 16:20:46 EST 2007 | davef
Bismuth is a low-melting metal with poor mechanical properties; if you melt the bismuth wire into a standard tin-lead solder joint, then the bismuth alloys with the solder, and forms a material that will crumble if you scrape it with your fingernail.
Electronics Forum | Tue Jun 26 21:36:48 EDT 2007 | davef
While your peak temperature measurement is probably correct, you probably ripped the pads from the board long before reaching that temperature. By using a steep temperature ramp, you are causing the corners of the BGA to curl away from the board and
