Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
Technical Library | 2020-07-01 19:45:04.0
A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free.
New Equipment | Education/Training
This is a combination lectured and hands-on course covering the information in the IPC J-STD-001 document. The J-STD-001, “Requirements for Soldered Electrical & Electronic Assemblies”, describes materials, method and acceptance
Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process development with solder alloy
PCB Reflow Oven Machine I.C.T Lyra Series I.C.T Lyra Series Reflow Oven is made with Nitrogen Standard. Customer can add nitrogen at any time in future I.C.T brings 26 years of experience in the SMT industry. On-site installation and training Availa
Used SMT Equipment | Soldering - Selective
Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
556-G-1940 G-SUB GUIDE LH UNIT for TDK Automatic component inserter accessories 446-1E-315 462-1Q-016 556-R-0050 561-R-0050 556-07-004 556-07-155 562-K-0090 602-24-056 602-32-204 603-00-005 603-04-072 603-09-060 604-05-037 2
Events Calendar | Tue Jun 02 00:00:00 EDT 2020 - Thu Jun 04 00:00:00 EDT 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
