Electronics Forum | Mon Nov 27 09:17:54 EST 2006 | lrd116
Could anyone please help me in my evaluation of Agilent vs. Omron vs. MIRTech/YESTech AOI? We are a high-mix low-to-mid volume manufacturer looking to gain not just a screening method but real process understanding that a Quality Engineer (myself) w
Electronics Forum | Tue May 06 12:49:50 EDT 2008 | markhoch
Ya know a little clear RTV around the feet of your conveyors will keep them from moving when Bubba the Quality Director needs to take a load off and leans against it. And if you ever need to move them later, just cut around the base with a box cutter
Electronics Forum | Wed May 07 10:15:46 EDT 2008 | llaerum
We are also having some issues with certain small parts. In our case this is tantalum caps and 0402 caps. We had a vendor admit after much discussion that the plating used from a particular orgin was different on the tantalums. The tehory is thatthsi
Electronics Forum | Thu Feb 05 23:55:52 EST 2009 | sachu_70
Considering a lean management on your shopfloor, any amount of inspection being done to a board, either by QA or Production personnel, does not add value to your product but instead, adds to your operational cost. You can explore to possibility of ca
Electronics Forum | Mon Aug 18 17:15:15 EDT 2008 | jlawson
This can be seen on leaded soldering also as well as LF (worse with LF). To reduce this you can look at your stencil and profile. Printing a cross-hatch deposit can reduce the voiding as it allow gasses to release when in reflow - thats the theory
Electronics Forum | Wed Sep 10 10:49:23 EDT 2008 | slthomas
You missed my point. People often don't find the need to post their problems here to begin with because "knob turning" solved them *before* they needed to lean on the collective experience of SMTnet, Technet, or what-have-you. Your posts seem to b
Electronics Forum | Tue Jul 20 15:10:00 EDT 2010 | vetteboy86
Recently we have expereinced solder issues with our reflow process. The issue is random and doesn't effect every assembly. I'm seeing extreme solder wicking, no solder flow onto the pads, only onto the leads of the components. I have tried to hand
Electronics Forum | Wed Aug 27 15:18:51 EDT 2014 | mrp
Hi. I decided to answer to your question, despite this is asked 2 years ago. I believe that my answer will be useful also for others, who visit Lean forums. I would recommend to use some proven MRP SaaS (cloud), because there are many such softwa
Electronics Forum | Fri Jul 13 08:03:54 EDT 2012 | cobham1
I appreciate all the feedback. The reason I was asking the question is because we have an internal documnet that states we need to bake for 16 hours after the boards are cleaned. This just seemed to long for what little moisture is really removed. I
Electronics Forum | Wed Oct 03 19:28:58 EDT 2012 | rgduval
Given that you're seeing it on nearly every part, we tend to lean towards Dave's explanation. We wouldn't expect outgassing from the pad to be an issue (at least, we've never heard of it before, which doesn't, necessarily, eliminate it as a potentia
