Electronics Forum | Sun May 01 00:42:02 EDT 2005 | KEN
What is your price difference between the #3 and the #4 powder. ....see where I'm taking this?
Electronics Forum | Tue May 03 05:46:43 EDT 2005 | mattkehoe
Consider ssd for your BGA's. http://www.sipad.com/SIPAD_NASA_Plots.htm www.sipad.net mkehoe@sipad.net
Electronics Forum | Fri Sep 11 14:39:02 EDT 1998 | Earl Moon
| Thanks to all Earl, Mathew and David for the SMT info. I have one more question. Does anybody have a chart listing the standard, industrial spacings? Perhaps listing in each unit, say XX mils = XX Pitch. Or XX mils = XXmm or something of that n
Electronics Forum | Wed Mar 03 07:29:34 EST 2004 | pjc
2D will give you on-line contrast inspection for paste coverage on the land. I would go with 2D on the printer when comparing to an AOI that will do the same contrast inspection. There are systems out there that will check paste hieght and area cover
Electronics Forum | Wed Apr 27 13:17:14 EDT 2005 | grantp
Hi, That was one of the recommendations made when I had the problem, but I never followed it up. Would the outside corners of the square aperture be on the edge of the pad, so you would be putting down less paste on a smaller aperture, but it's sq
Electronics Forum | Wed Apr 27 20:55:10 EDT 2005 | KEN
One thing that may have been over looked: Not all solder pastes are created equal. Period. The best way to avoid these situations is to characterize you material (and your process). The fact is you could try every aperture shape under the sun....a
Electronics Forum | Tue Apr 26 18:23:30 EDT 2005 | russ
How does your machine recognize the part? Does it use vision for ball inspection or a just a body scan? What is the aperture size on the stencil? Have you calculated the area ratio? What is the aperture shape? What type of paste are you using? is
Electronics Forum | Wed Apr 27 07:16:40 EDT 2005 | jdumont
Thanks a lot guys. The part dims are in mm by the way. So last night i was looking at the .pcb file and saw that the pad size and stencil are both .013" while the ball on the BGA is .018" (sorry for switching from metric). Is this ok or can i have en
Electronics Forum | Sat Sep 12 10:47:00 EDT 1998 | Jon Medernach
I am aware that the Intel processor is available in a 0.012" leadframe, as a TAB product ( which can be excised and placed with may P&P machines but I do not know of any 0.008" leadframes, Bumped Die are at these pitches and frankly I would bet dime
Electronics Forum | Wed Apr 27 02:22:08 EDT 2005 | grantp
Hi, There are a number of things you can try. You are already using 1:1 hole to pad ratio, and that's good as you need the size. I would try an electroform stencil as that will have a smooth side of the aperture and help paste release. Don't use c
