Electronics Forum | Mon Sep 18 20:51:35 EDT 2000 | Dave F
A fairly dense brickwall would have 0.020" (0.05mm) spacing
Electronics Forum | Fri Mar 03 14:08:55 EST 2000 | Michael Parker
Your best answer for determining cleaning method is to contact your stencil supplier and follow their recommendation. Periodic inspection of your apertures (using microscope, or minimum 10x magnification) would also be a good idea to make sure that g
Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef
Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.
Electronics Forum | Mon Jun 18 18:17:10 EDT 2001 | davef
What to you consider to be the minimum resolution [micron] for: General, BGA, die attach uBGA, flipchip, wire bonds Wire cracks, delamination Microcircuit failure What is the relationship between resolution [micron] and the kV of the tube?
Electronics Forum | Tue Nov 16 09:37:53 EST 1999 | Ted C
Is anyone out there using automatic despensing equipment rather than stencils for depositing paste on BGA patterns prior to placement/repair. What is minimum dot size that can be reliably applied. Pro's/con's?
Electronics Forum | Thu Oct 07 20:34:48 EDT 1999 | Tony Huang
Hi, Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! Thanks, Tony
Electronics Forum | Fri Jul 30 20:27:49 EDT 1999 | Dior
Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board.
Electronics Forum | Sat Jul 31 13:27:42 EDT 1999 | Miguel Mariscal
| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. |
Electronics Forum | Fri Jan 22 17:39:12 EST 1999 | chang hong lin
Does anybody have information on the minimum spacing required between BGAs (i/o counts close to 696)to avoid damage during rework? Also, on the keep out requirements between CSPs (o.5 mm pitch); between CSPs and BGAs. thanks in advance for your hel
