Electronics Forum: mount devices (Page 8 of 24)

Moisture Barrier bags

Electronics Forum | Mon Apr 29 22:41:36 EDT 2002 | davef

Refer to J-STD-33 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface-Mount Devices. You can be downloaded it free from http://www.jedec.org Assuming you want to meet expectations when selling your components to

Newb needs to bake some chips help.....

Electronics Forum | Tue Jul 22 20:47:21 EDT 2008 | davef

Q1. Can I do this myself on site? A1. Sure. Most companies demoisturate their components in-house. Q2. Can we use our Vitronics Soltec XPM820 Reflow Oven? A2. You can. Most of us would be using an oven like that in our product processing. If you look

Re: castellations vs. no castellations

Electronics Forum | Tue Jul 27 16:30:35 EDT 1999 | Earl Moon

Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of

Line tech in need of help

Electronics Forum | Fri Mar 09 11:19:13 EST 2001 | mirrin

OOPS........FORGOT TO MENTION THE FACT THAT ALL THRU HOLE DEVICES ARE PLACED POST SURFACE MOUNT !!! SORRY MIKE. DALE.

Re: Via-in-pad

Electronics Forum | Tue Jan 25 21:59:44 EST 2000 | Dave F

Michael: On reliabiliity, consider that: � IPC-SM-782, "Surface Mount Design And Land Pattern Standard" and IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies" specifically describe via in pads as "poor des

Rework Station for SMD PCBs

Electronics Forum | Tue Nov 20 19:56:12 EST 2012 | hegemon

In order to be able to do full prototype assembly, you will need to be able to mount and reflow a large number of different devices of differing technology. One part might be a simple QFP, another might be a .4mm pitch uBGA. If you are prototyping a

Local fiducials

Electronics Forum | Wed Oct 20 08:40:48 EDT 2010 | xps

Hi everyone, here a question for the SMT production engineers... is possible today mount the fine pitch and ultrafine pitch devices (BGA, QFP, CSP), without using the local fiducials, but using the three standard fiducials of row card only? The corre

BGA Corner

Electronics Forum | Wed Jun 15 13:40:49 EDT 2011 | hegemon

I have seen this before with larger PBGA components. When installed using a rework system, I would advise Convective rather thn IR. In my experience having high power (not high temp) convection is the only way to deal with these problematic devices

Solder cover

Electronics Forum | Wed Mar 03 06:13:23 EST 2010 | grahamcooper22

The picture shows that the heel of the device lead is not on the pad. Either bad placement or wrong pad dimensions. I imagine most customers would reject this joint as only a small part of the lead is actually in the solder. With no heel fillet the j

Re: BGA Warp

Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon

Hi All, Any one experince BGA-chipset warp about 10-15mil after removing from PCB? FYI, the rework temperature for preheat was 170C from room temperature about 30 seconds, & BGA was removed at temperature between 190-200C.


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