Electronics Forum: msc and 16 (Page 8 of 62)

No Clean and Underfill

Electronics Forum | Wed Mar 04 14:35:16 EST 2009 | clampron

Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does any

QFN's and LGA's

Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell

Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems

GSM2 and FlexJet heads

Electronics Forum | Sat Oct 10 16:05:27 EDT 2009 | dilogic

I would if someone can share his "real-life" experience with FlexJet (7-spindle) heads. We are currently running machines with Flex heads (4-spindle), which are very easy to maintain, but I suppose 7-spindle has more throughput. All comments are welc

Pick and Place Machine

Electronics Forum | Tue Aug 16 23:23:03 EDT 2011 | ckyien

Hi, my company is looking for SMT lines. Currently our target for pick and place machine is on Yamaha YS12P/YS12F and Juki 2080L/3020L. Kindly please share your comments of pros and cons of these machines. Also please recommend other brands and mod

Inventory control and maintenance

Electronics Forum | Tue Feb 24 16:11:15 EST 2015 | emeto

I assume you have a part number system. If so, you should kit the reel with less parts first from the same part number. If you don't use part number system, then you probably have components sorted by value and size, which should lead to the same pri

tape and reel machine

Electronics Forum | Fri Mar 24 15:20:27 EST 2000 | Chris McDonald

I have recently purchased a Tape and reel machine from V-Tech. We are using Presure Sensitive tape and we are not geting good results. Anything bigger that a SOIC14/16 gives us trouble. The cover tape will pull off on the feeder and we will lose part

CSP and underfill

Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C

LPMTF and EMTF

Electronics Forum | Fri Jan 17 16:42:47 EST 2003 | MA/NY DDave

Gee this was a fun tread. I guess you mean Univeral Instrument Corporation's products. I would give them a call since they have a training center in Binghamton, NY and may have what you need. Trust me, They need the business and should jump all ov

AOI, Quality and SPC

Electronics Forum | Tue Mar 04 16:02:53 EST 2003 | Dave C.

We have auto-correct funtion on our Panasonic Create CM-301 placement machines but have never turned it on because of a perceived loss of placement time when the camera verifies placement. We look at the first article and correct placemnt if needed.

0402's and Gluing.............

Electronics Forum | Wed Feb 16 21:26:11 EST 2005 | Mrduckmann2000

Well, I have not had a chance to run my experiment yet. I hope to have the wave solder machine to myself on Friday morning. I will let you know. I am hopefull from what you and the others have said that it will work and we can reduce our touch lab


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