Electronics Forum | Tue Apr 29 09:43:30 EDT 2003 | davef
With a nickel barrier and 'tin' plating, reconsider your reflow recipe to reduce the leaching of the termination into the solder during reflow. Points are: * In designing a reflow temperature recipe, it is important that the temperature be raised at
Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer
| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard
Electronics Forum | Tue Sep 24 14:38:53 EDT 2002 | Jim M.
The EMS company i work for assembles a small PCB board that requires 10 solid press fit pins installed. The pins are Phosphor Bronze, CDA-510 Alloy, Grade A, 3/4 hard with a finish of .00012 min tin/lead over .00005 min nickel.I would like these pla
Electronics Forum | Wed Apr 09 13:30:20 EDT 2003 | davef
In order to get reliable reflow, you need to be at or higher than [liquidus + 20*C] for about 5 to 10 seconds. [I said 25* in a earlier post, but in an effort to stay on message, I'll stick with 20*] Don't forget that your liquidous is probably NOT
Electronics Forum | Tue Mar 14 13:42:45 EST 2006 | patrickbruneel
If the OSP boards have gone through double reflow I assume that you use an aggressive (halide) flux for wave soldering. SAC 305 is known (search the archives) to dissolve copper faster than other lead-free alloys. This together with an aggressive flu
Electronics Forum | Fri May 12 11:40:25 EDT 2006 | solderiron
If you can change to SN100C do it. The nickel prevents the high tin content from eating away at the metals on the tips. Similar to what the Lead did in 63/37 alloys. This Koki crap is just that, crap. 99% tin??? Thats what is causing the problem peop
Electronics Forum | Fri Jun 09 12:51:52 EDT 2006 | flipit
You can not solder to 30 micro inches of gold over nickel and certainly not 80 microns. You can not with tin lead solder or SAC305 anyway. The upper limit is between 6 and 10 micro inches of gold. This is what ENIG plates to. If you solder to gre
Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F
Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca
Electronics Forum | Thu Jul 27 21:57:16 EDT 2000 | Dave F
Hi Doug: Responding to your questions: � If gold over nickel is self limiting ... You didn�t say whether you gold plating was electroless or immersion. Electroless is not is self limiting. It can plate up to 5 thou. Expect immersion plated gold to
Electronics Forum | Tue Oct 03 17:04:07 EDT 2006 | cuculi54986@yahoo.com
Glenn, What alloy are you using for Pb-free HASL? You say tin copper nickel, but is it SN100C? Against manufacturing engineering's recommendation, my company specified simply "Pb-free HASL" as the finish for our Pb-free PCBs. One of our suppliers
