Electronics Forum | Sat Feb 02 08:55:55 EST 2002 | davef
I'd don't believe that the reels need to be ESD protective material. The carrier and cover tape have resistivity and materials specifications. Start with EIA-481. In past threads on SMTnet, we have discussed problems in picking components that wer
Electronics Forum | Thu Apr 24 15:48:09 EDT 2003 | razor
Known: During PCB maufacting nickel alloys are used for corrosion resistance during gold immersion process. A nickel alloy with a high phosphorus concentration will cause a weak connection interface. Question: Is the concentration of phosphorus in ni
Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef
"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make
Electronics Forum | Fri Jun 04 09:20:55 EDT 1999 | HST-SE
Al, We make stencils, and I was personally involved at AMTX when the electroformed process was developed. Some of this will sound like an ad, but everyone has been volunteering vendors and so look at this as a suggestion. Electroforming is an addit
Electronics Forum | Sat Oct 24 13:03:20 EDT 2015 | mikekeens
With regards to PCB surface finish I would recommend Electroless Nickel Immersion Gold (ENIG) because of the long shelf life, tarnish resistance, RoHS-compliance, and easy soldering compared to other surface finishes. http://www.surfacemountprocess.
Electronics Forum | Wed Sep 10 14:14:03 EDT 2008 | gregoryyork
Yes why did the Electroless Nickel layer split this is the ROOT cause. My guess is still that the resist was slightly miss registered over the copper and therefore poor adhesion of the Nickel ensued OR like I said originally the resist had contaminat
Electronics Forum | Sat Jul 05 07:30:04 EDT 2003 | AlCapone
If the problem as you described as the gold plating contaminated, and the Nickel layer exposed to the solder pot. However, the purpose of the gold layer is to protect the nickel and copper layer not turn into corrosion and resist to other issue (humi
Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel
Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n
Electronics Forum | Tue Feb 21 01:32:49 EST 2017 | soldertraining
Looking for advice on soldering lead free paste to a board with very heavy gold plating, In my opinion, Gold contact surfaces are often used on circuit boards with membrane switches which is a choice of technology for industrial, commercial and consu
Electronics Forum | Thu Jun 01 21:54:00 EDT 2000 | Dave F
Jeremy: Standards: � A-600 talks about percentage of solder mask loss allowed, according to the location (eg, laminate, bare copper, gold or nickel, melting metals) and equipment class. � A-610 talks to "Solder Resist Coating - Voids & Blisters" by
