Electronics Forum | Mon Mar 30 08:11:22 EST 1998 | Derek Drabenstadt
Does anyone have any experience with fired-silver/platinum/palladium lead terminations soldering. I have had issues on nickel over gold plated boards but not with HASL'd boards with tin/lead pads. Is this the norm?
Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef
Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl
Electronics Forum | Mon Apr 18 12:28:33 EDT 2005 | davef
We've never heard of it either. Stained glass widow people use varous types of copper and brass tape / foil in their work. A widely used suppler of this tape is Venture [ http://www.venturetape.com ]. They may be able to help. We're not sure how
Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris
Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o
Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris
Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o
Electronics Forum | Mon Nov 04 07:31:54 EST 2019 | amitthepcbguy
As a manufacturer, I prefer plated nickel gold, electroless nickel immersion gold, immersion silver and palladium. These surface finishes are the best options to replace leaded surface finishes. These surface finishes can withstand higher temperature
Electronics Forum | Thu Sep 15 02:51:45 EDT 2005 | Joris Groot Koerkamp
In our current process we don't need to dry our pcb's. We use FR4 HASL boards. For the leadfree process we want to use NickelGold plated boards. Do we have to dry these boards for the leadfree process or can we just seal them with silica gel?
Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup
| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I
Electronics Forum | Tue Jul 08 20:43:03 EDT 2003 | davef
AlCapone: We have an understanding similar to yours, but slightly different. * At 230*C gold dissolves in to solder at the following rate: 63/37: 197 uinch/sec [5 um/sec]. So for a typical ENIG solderability protection, the gold is gone in about a s
Electronics Forum | Tue Jul 05 11:00:37 EDT 2005 | patrickbruneel
Inds, This will happen with all lead-free alloys having a tin content above 70%. It takes about 30 sec. for a molten lead-free alloy to totally dissolve a copper pad. The higher the temperature the shorter the time and visa versa. The scary part of
