Electronics Forum | Thu Dec 03 21:40:01 EST 2020 | itmconsulting
Hey Kyle - Good for you for pushing your horizons and considering pin-in-paste (aka "Intrusive Soldering"). Don't let the nay-sayers out there discourage you. When I encounter mixed tech PCBAs (SMT and through-hole) my first choice, if the design a
Electronics Forum | Wed Feb 20 12:22:14 EST 2008 | tonyamenson
iv40, I don't suppose you know/remember what base material you were using that caused the problem and what material you switched to was, do you? We just pre-bake all our lead free PCBs as a precuation but I would like to remove the process if I can
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Fri Jul 04 21:09:04 EDT 2003 | ramanandkini
I have a CEM-1 PCB board with 35 microns copper. This is PCB is finished with SMOBC+HALS. We do solder SMT LEDs, but till date we do not have problems that you have listed. The LEDs are good & bright. It even passed high & low temp cycle tests (-40 t
Electronics Forum | Sun Aug 02 20:31:22 EDT 1998 | karlin
Hi Bob, The weight of the TBGA is heavier then PBGA due to the Stainless steel heat sink. I have tried run them through the oven without paste. Due to the high lead content( 90Pb/Sn10), the "solder: did not melt. Still see the misalignment issue but
Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Tue Oct 05 14:34:40 EDT 2010 | 18424
I am trying to assess current industry thinking > on the question of whether or not lead-free BGAs > (SAC or other) can or should be soldered in a > tin/lead process. It seems there are differing > opinions on this and I'm wondering what some of
Electronics Forum | Tue Jan 30 18:25:25 EST 2018 | aqueous
This is one of the most common questions I get asked. Why clean no-clean flux. It was stated earlier that no-clean residues are benign. This may or may not be accurate. It depends on several factors including the reflow process. In a perfect world, t
Electronics Forum | Wed Oct 06 12:45:01 EDT 2010 | blnorman
I've seen studies were Pb-free BGAs in a leaded process have no reliability issues when a lead free profile is used. Pb-free profile ensure proper ball collapse and solder joint formation.
Electronics Forum | Tue Oct 05 15:20:45 EDT 2010 | scottp
I agree that in consumer electronics there may be nothing wrong with using a lead free BGA in a SnPb process, but that blanket statement can't be made for the high reliability market.
