Electronics Forum | Thu Sep 17 08:23:03 EDT 1998 | Wayne Carlson
I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas?
Electronics Forum | Fri Jun 29 23:10:02 EDT 2001 | Danial
Thanx for the reply guys!! The problem happened on only one PBGA, the balls are eutectic and the paste volume height is at 5.96 mil min. The stencil opening has been increased to 30 mil which initially was 20 mil. You guys are right!! One probable
Electronics Forum | Mon Dec 13 16:25:37 EST 2004 | saragorcos
Hi Scott - No clean assemblies have a very low tolerance for processing residues, and long term reliability is compromised if residues from incoming bare boards, components, or un-solublized flux residues are not dealt with. It is critical to contro
Electronics Forum | Fri May 27 17:21:35 EDT 2005 | mrclean
Dear SM Rookies, Another acceptable test method is visual inspection. IPC-A-610 details what to look for with different contaminants, providing magnified pictures of the possible visual residues. With an existing cleaning process, magnification
Electronics Forum | Mon Mar 07 15:41:50 EST 2005 | John M
Is anyone aware of standards which would identify the clean room requirements for the wire bonding process ?
Electronics Forum | Tue Nov 02 08:36:51 EDT 2010 | rgduval
Michelle, Our experience with no-clean solder pastes has been that water washing a mis-print is a bad idea. We've found that DI water does not do a sufficient job removing the no-clean paste (the same goes for stencils). Instead, we have washed no
Electronics Forum | Tue Nov 02 07:50:18 EDT 2010 | babe7362000
I just need a clarification on NC254 No clean solder paste. If we have parts on the bottom side of the board that already are soldered and we go to run the other side of the board and it was misprinted, is it ok to run thru the washer? I just need
Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric
Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.
Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe
Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.
Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
