Electronics Forum | Mon Aug 31 22:30:09 EDT 1998 | Kelly Morris
We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. The center
Electronics Forum | Tue Sep 01 19:16:51 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Wed Sep 27 17:49:41 EDT 2006 | SWAG
Open the rear door that has the cooling fans on it. Look at the wiper blade regulator, look toward the front of the machine about 8" or so and to then left 3"or 4". There should be a lexan cover/box over the board that has this pot. on it. If stil
Electronics Forum | Mon May 21 17:37:51 EDT 2001 | davef
IPC-2222, Sectional Design Standard For Printed Board For Organic Printed Boards talks to scoring parameters in para. 5.3.1. You can obtain the standard at: http:///www.ipc.org. and Document Center [http://www.document-center.com/home.cfm/sid=71285
Electronics Forum | Tue Apr 27 14:54:26 EDT 2004 | Kirk
reduction apertures in stencil and question how find center?. I thought that vision start playing important role at the beginning for the first PCB, help set precisely printing process. You gave tip to work without Mylar. Ok but again how you set ste
Electronics Forum | Fri Jul 22 16:42:50 EDT 2005 | campos
hello all, I�m experiencing problems with "warped" boards after first reflow, some of them i just can�t print side two due to this problem,,is it related only to reflow? i�m using a linear profile (225� peak / 70s time above) with a tin lead paste,t
Electronics Forum | Mon Mar 10 09:19:15 EDT 2008 | lysik
As you know 90% of defects come from the printer. This product is well worth the investment. You will improve yeilds and reduce rework. Very important with micro BGA's. Also lead free components do not self center (during reflow) as well. There is ve
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Fri Jun 02 23:22:09 EDT 2023 | ttheis
MPM's had great software, we had a UP500 but it was slow. Our Dek's are very fast and the software is decent but not as good when it comes to some basic stuff like board stop offsets on images that are off center. It doesn't give clear information wh
