Electronics Forum: note (Page 8 of 106)

BOM Merging

Electronics Forum | Fri Jul 16 16:01:12 EDT 2004 | stefwitt

Send me your e-mail. I have a program, which joins BOM into a placement file. The program doesn't have an author nor a copyright note = shareware. stefwitt@netzero.net

Sony CXD3123R

Electronics Forum | Sun Aug 29 16:25:42 EDT 2004 | Ilker Atalay

Hello, Does anyone have Sony CXD3123R datasheets and application notes ? Please email me. Regards, Ilker ilker.atalay@betomed.com

Destruction of Proprietary Information

Electronics Forum | Fri Feb 11 19:13:09 EST 2005 | primus

Your site takes day to download. Please add a > button that allows by-passing all the graphics > and whatnot. Note on front page: REQUIREMENTS Netscape or IE 4.0 or higher BROADBAND CONNECTION That might help...

Wave Soldering Process Training Material

Electronics Forum | Tue Mar 29 07:59:19 EST 2005 | pjc

See "Wavesolder Process Troubleshooting Wizard" on this page: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnId=5

Damage Component

Electronics Forum | Wed Apr 27 23:00:06 EDT 2005 | pdeuel

Definetly need more infomation. What kind of machine? What type of tool? Where in the process id damage noted, before or after reflow? What type of part? have you tried changing vendor?

One of a kind!

Electronics Forum | Fri May 27 08:55:45 EDT 2005 | cyber_wolf

Quick note on Hover Davis, I am not impressed with their Fuji IP feeders at all. They short out and blow IC's up in the MFU's They sell their own feeder set up stand to tell whether or not you have a shorted feeder. What the hell is up with that ?

Solder bridging after printing

Electronics Forum | Sat Jun 25 10:04:08 EDT 2005 | ktron

Hi MSK, Stencil thickness: 5mils with laser cut Smallest pitch: 20mils Underscreen cleaning frequency: 10 bds per cleaning Note: We have decreased the cleaning frequency from 10 boards to 3 bds to reduce solder bridging after printing Regards,

Solder balls under LLP

Electronics Forum | Mon Aug 29 13:05:11 EDT 2005 | solderguy

Hi All, In IPC-A-610 there is a definition for what constitutes "Entrapped/encapsulated/attached" on page 5-14 in the note. It says that it means that the ball will not be dislodged in the normal service environment of the product. Jim Jenkins

Wrinkles on soldered BGA ball joints

Electronics Forum | Fri Oct 07 09:19:54 EDT 2005 | Kris

the direction in which the solders cool in a BGA are also different than the rest of the boards as the joints " hidden" to ambient. Refer to an analogus phenomenon in the cookson application note. http://www.cooksonsemi.com/pdfs/How%20&%20Why%20Bum

How do you number your stencils ?

Electronics Forum | Thu Oct 27 09:43:59 EDT 2005 | PWH

As Mark states, we have also used tape to cover sharpie notes and part numbers. Works well. We use kapton tape.


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