Electronics Forum: osp and pcb and solder (Page 8 of 20)

Re: BGA and PCB finishing

Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX

Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh

Re: BGA and PCB finishing

Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX

Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh

Via holes and Wave Solder

Electronics Forum | Tue Mar 07 08:48:55 EST 2006 | samir

Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0.040" diameter, and spaced at 0.004" edge to edge spacing! He doesn't like to tent the via's either, so I always battle via-to-via shorts at the wave

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh

Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr

Wave Cassettes and Heat convection

Electronics Forum | Mon Jan 15 09:19:29 EST 2007 | tk380514

We use Alpha EF-2202 low-VOC No-Clean flux Selective wave soldering cassettes Bottom pre-heating wave soldering machine We have one component that will not solder properly: http://www.epcos.com/web/generator/Web/Sections/ProductCatalog/Capacitors/Ul

Fine pitch and thick copper

Electronics Forum | Wed Dec 08 04:19:16 EST 1999 | pascal MATHIEU

I am working in electronic automotive industry and today we are facing to a very serious problem : if we want to use a PCBoard with a copper thickness of 90�m + fine pitch circuit (0.65mm, 0.5mm) the supplier(several) of the PCB has some trouble t

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway

I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste

BGA ball and PCB pad

Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan

Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor

SPI and AOI Machine Feaures.

Electronics Forum | Wed Feb 10 05:23:17 EST 2021 | karl_willoughby

Hello. I am sourcing machines for an SMT line (for the first time) and would like to understand features of current and earlier model SPI and AOI machines. In the intended application, a high volume of PCAs aren't required to be processed but there

BGA ball and PCB pad

Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W

There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.


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