Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
Electronics Forum | Thu Sep 14 20:11:19 EDT 2006 | davef
You weren't specific about the OSP that you use. We use Entek Plus CU-106A. Yes, just about everything removes Entek, especially if there's heat involved. Ethone states: * Alcohol strips 70% of the coating * Water removes 15% * Kyzen Lonox only t
Electronics Forum | Wed Jun 10 18:44:58 EDT 1998 | Earl Moon
| Okay, here's a stupid question. What exactly is HASL and OSP? We are going to delve into this technology where I work and I want to utilize the wealth of knowledge here to make life easier. Specifically, what are the differences, the advantages, di
Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Thu Jun 27 06:22:30 EDT 2019 | robl
OSP is water based so guessing more involved is evaporation and dilution from humidity. From memory this may have been something to do with loosely bound electrons to the nitrogen atoms that could be easily freed up compromising the coating, but I
Electronics Forum | Tue May 26 15:27:36 EDT 1998 | Dave F
| | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and s
Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Thu Apr 16 14:09:04 EDT 1998 | Lou Madge
Dear Collegue, A seminar tittled "Things that you should know before selecting an alternative surface finish" will be offered on Friday, April 24 (during the week of the Nepcon East show) in Philadelphia. Topic that will be discussed include: Evalua
