Electronics Forum | Thu Apr 05 22:24:32 EDT 2001 | davef
I think your solder mask is a partial cause of your solder balling. Additionally, adjusting some machine set-up parameters may also help. 1 If we were talking about a single assembly problem, we�d be thinking about the laminate, but since you say t
Electronics Forum | Thu Aug 16 08:15:04 EDT 2018 | muzzy
Hello! Does anybody know how to access the "MS Parameters" window on older JUKI Pick and place machines? (mainly on 730, 740, 750, 760). Service manual mentions that it is possible to change all of the mechanical parameters from there (like for examp
Electronics Forum | Thu Jan 02 10:31:48 EST 2020 | slthomas
It is strange that you're having issues while using the same process parameters (including stencil) that worked successfully before. It doesn't guarantee that it's not one of those parameters changing in a manner that's not apparent, but it does sugg
Electronics Forum | Mon Aug 07 04:05:43 EDT 2023 | suradi
May I share regarding this issue. Initially, please define the root cause clearly, is it from materials or process. Refer to the picture, if the short location is not randomly meaning there is the process issue. It could be stencil design or paste pr
Electronics Forum | Mon Nov 20 04:39:19 EST 2000 | SV
Hello, I have to design a PCB for which the customer have the following temperature requirements: -55degC to +85degC operating temp. -61degC to +125degC storage temp. My question is: does the FR4 material meet this conditions? Which are the parame
Electronics Forum | Fri Jan 26 08:28:59 EST 2001 | Sal
I am currently in the Process of setting up some SPC software on our Wavesoldering equipment. What I would like to know for each Parameter that is listed below what kind of variation from my average setpoint would cause defects.Example. If the averag
Electronics Forum | Wed Sep 20 09:02:24 EDT 2000 | Erick Russell
The programming is simple and is based on just a few simple parameters. There is no CAD interface required to program the equipment. You must key in the dimensions of the component (X-Y and Thickness) and then specify the required thermal process.
Electronics Forum | Fri Aug 13 00:08:16 EDT 1999 | FMung
| | | Hello, | | | | | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | | | | | B.Regards, | | | Felix | | | | | I have a process cause and eff
Electronics Forum | Tue Mar 24 13:21:16 EST 1998 | Earl Moon
| Should I use thermals or direct connects on | vias from BGA pads to power planes. The via is | connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capab
Electronics Forum | Mon Jan 20 19:07:41 EST 2003 | slthomas
Sorry, what I meant was that they don't provide a duration for that liquidus + 20�C value that I've seen bantered about here and on TechNet. They only provide the same stock time above liquidus of 30-90 that they've always used. I'd like to see refe
