Electronics Forum: paste mesh (Page 8 of 13)

Re: Strange problem with my dispenser

Electronics Forum | Wed Aug 11 10:21:03 EDT 1999 | Brian

| Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation

Re: screen printer and stencil printer

Electronics Forum | Wed Aug 18 21:10:23 EDT 1999 | se

| | | Hi, | | | I'd like to ask some tips about the merits and shortcomings o | | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | | application? | | | The board

Solder Clogging

Electronics Forum | Tue Jun 15 19:14:51 EDT 2010 | hegemon

You also need to consider the total metal load in your dispensable paste. You'll need a slightly higher flux content and less metal, say around 87% total metal, in a 4 or 5 mesh size. We had to have some special mixes made in order to do fine pitch

Re: Paste Dispensing

Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F

John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa

Re: Paste Dispensing

Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F

John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa

Re: problem in micro-BGA assembly

Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff

| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes

Solder Printing 2x2 inch ceramic Substrate

Electronics Forum | Thu Feb 15 10:40:27 EST 2007 | phil69

Hi All, I was wondering if anyone has experience of printing solder paste on to 2x2" ceramic substrates.. At present we are using a very old de haart printer with a mesh emulsion screen.. I am looking to replace this with a more reliable mo

PWAs & PWB bake out requirements

Electronics Forum | Sat Aug 18 08:40:34 EDT 2007 | davef

Here's how to double reflow your QFP: * Reflow the first side with the QFP according to plan. * Paste second side and place components according to plan. * Lightly crinkle a small, QFP-size piece of aluminum foil. [Note: the degree of crinklization

Stencil Design

Electronics Forum | Tue Sep 16 13:40:20 EDT 2008 | ck_the_flip

Try reductions in the "Y direction". For the SMALL PAD, go from 16-mils to 14-mils, and on the large pad, you can play around with reductions on the 14x24mil pad...or try mesh pattern. You'll be well with area-ratio guidelines with both approaches,

Polyimide See Thru Stencils for Printing Solder Paste

Electronics Forum | Tue Jun 23 11:27:37 EDT 1998 | Russ M

Has anyone seen/used these yet? They seem to have lower coefficient of friction for release of paste and less wear and tear as well as conforming to the board better (plastic has better memory than stainless). Also there is no mesh so a larger image


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