Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu
Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as
Electronics Forum | Tue Jan 20 08:38:37 EST 2009 | davef
MrDif: You don't add fresh paste to used paste? We add fresh paste to used paste on the stencil to replenish the paste consumed while printing boards, so that we maintain a nice thumb-size roll of paste. We change the used paste when we clean the ste
Electronics Forum | Tue Jan 20 07:57:00 EST 2009 | mrdtech
Depends on the solder paste. If it has been on the stencil for 24h there is a good chance that the paste is destroyed. You can however check if it has not dried out too much by letting the stencil printer do a few strokes and see if the paste still h
Electronics Forum | Sat Jan 17 17:42:07 EST 2009 | viresh
what is the impact if a solder paste is used after 24 hours after tawing time
Electronics Forum | Wed Jan 21 03:34:05 EST 2009 | mrdtech
Sorry if that sentence there was not really clear. I meant: don't to try to 'revive' old paste or paste that has been on the stencil for a very long time using fresh paste.
Electronics Forum | Sun Jan 18 09:20:26 EST 2009 | davef
We're not sure of the condition of your solder paste. So, afte 24 hours, if it's: * Unused, in a reclosed container, maybe a week of life depending on the environment * Used, scrap A simple coalescence test can quickly determine the condition of sol
Electronics Forum | Mon Aug 14 14:27:00 EDT 2017 | emeto
Here is some food for thought. Try to answer these questions yourself and I am sure you will see huge improvement. Reasons: - Bad PCB design - Plating-uneven HASL cause more than OSP Au/Ni or Silver - Poor paste and print quality - uneven paste ca
Electronics Forum | Thu Jan 27 07:18:14 EST 2000 | Christopher Lampron
Dennis, The solder paste is responsible for holding the component in place pre-reflow. Several things to look at: Is the paste accurately printed on the pad? If not, there may not be enough of the component in contact with the paste to provide adiq
Electronics Forum | Thu Jan 27 19:14:27 EST 2000 | Dennis
Thanks! It is right that solder paste is somewhat responsible for misssing components in our case. I took a look at the board after placement and I found that component hit the paste, but no where on the board. I guesss dry solder paste (operater pri
Electronics Forum | Mon Aug 14 12:46:41 EDT 2017 | deanm
Any of the comments so far could be valid. To add my opinion, it looks like the pad size is too large. A smaller volume of solder will pull less than a larger volume. If you can't change the pad sizes, then the next thing to try is to get another ste
