Electronics Forum | Tue Sep 25 08:16:24 EDT 2001 | Carol Stirling
Hello Davef, Thanks for the info, your help is appreciated..I'm ordering 7095 today and we have the other two already. Have a great week...
Electronics Forum | Wed Jan 02 22:45:29 EST 2002 | davef
It's difficult to view more than four [maybe up to six] rows of balls deep. * Affording to replace the prisms in a production environment. * Justifying the purchase price [~$30k].
Electronics Forum | Fri Jun 28 11:25:01 EDT 2002 | dason_c
You need to check your pot temperature and the board surface temperature. You know the melting point of the 63/37 at 183C. If your top side surface temperature is above this point and second reflow may happen. Also, the board will warp and may cau
Electronics Forum | Mon Jul 15 00:31:34 EDT 2002 | ppcbs
If your just getting into BGA assembly or rework, I strongly suggest taking this class. It covers profiling and considerationds for heat sensitive BGA'sin depth. http://www.pcb-repair.com/bgarework.htm
Electronics Forum | Fri Jul 12 07:48:59 EDT 2002 | jax
I don't think there is a standard, too many variables, but I could be wrong. I believe ERSA wrote a technical article that deals with double drop. You can probably find it just by doing a web search.
Electronics Forum | Wed Aug 07 22:20:59 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional Publishing; ISBN: 0071351418; 1st edition (February 8, 2000)
Electronics Forum | Mon Jan 20 17:41:38 EST 2003 | James Springer; Advanced Technology Manager
Has anyone ever placed and reflowed a 1.27mm PBGA to 6 mil poly flex bonded to aluminum? If so what is the life expectancy of the solder joints?
Electronics Forum | Tue Jan 28 18:24:32 EST 2003 | rob_thomas
Hi James, It's been done and tested and at my previous job.The solder joints life expectancy is the same as for PBGA's attached to rigid substrates. If you want more details and process specific details send me an e-mail at the above address. Good l
Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen
The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating
Electronics Forum | Wed Aug 13 18:12:20 EDT 2003 | Carol
Has anyone tried to get conformal coating under a BGA? (large package MPC555). There is a concern with ionic/metal bridges developing between contacts due to accumulation of dust/humididty. Final product is Class 3 (aerospace). Thanks, Carol
