Electronics Forum | Thu Apr 13 10:05:47 EDT 2006 | daxman
Okay fellas...I posted awhile back regarding CP4 and CP6 placement issues. I think we may have figured it out. XO/YO and mark read positions were not correct. However, we have a new problem with the CP4-2. I was running the Fuji board, placing a s
Electronics Forum | Thu Oct 02 16:22:46 EDT 2008 | davef
Not all paste formulators offer suggestions on handling the storage of opened paste jars, but some do. Here's a couple. Storing Opened Solder Paste Containers * Once a jar or cartridge has been opened it should not be re-refrigerated. If solder past
Electronics Forum | Thu Mar 29 15:50:35 EST 2001 | tomgervascio
We've think that with seen solder shorts under BGAs after wave soldering the boards. In addition, it seems to be related to a certain soldermask configuration over the topside BGA vias.. THere is one vendor,A, that is applying soldermask after HASL,
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Tue Jul 21 10:36:31 EDT 1998 | Justin Medernach
| | Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment you
Electronics Forum | Mon Aug 03 20:07:37 EDT 1998 | Dave Kalen
| | | Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | | | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment
Electronics Forum | Thu Apr 14 13:10:49 EDT 2005 | Shean Dalton
Hi John, A primary consideration is the type of flux you are using. If it's water soluble (organic acid) then cleaning is highly recommended. Any other flux that fails the copper mirror test, we'd strongly recommend cleaning. Passing the copper m
Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef
We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther
Electronics Forum | Tue Aug 17 09:43:59 EDT 2021 | lay1014
Application of vacuum technology VACUUM FURNACE Metallurgical industry: The vacuum technology used in the metallurgical industry includes molten steel vacuum processing, vacuum melting, vacuum induction melting, induction shell melting, vacuum arc re
Electronics Forum | Mon Sep 27 15:17:02 EDT 2021 | dcrainey
Thanks
