Electronics Forum | Wed Mar 18 01:50:45 EST 1998 | Phil Szypko
| | Hi all, | I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info
Electronics Forum | Fri Apr 12 15:48:33 EDT 2002 | jersbo
SPC for each assembly(I use C(for board defects)NP(for unit defects) at the end of reflow to determine process capabilities determine Control limits. Once control limits are set, inspectors stop the process until out of control limit is addressed and
Electronics Forum | Thu Mar 06 14:10:26 EST 2003 | gregp
Hello Mike, The IPC has recently released a specification (IPC-9850) that characterizes the performance of placement machines. The process is very similar to the process you describe (placing parts on a glass plate and measuring the results). The I
Electronics Forum | Mon Mar 08 11:54:06 EST 2004 | Wayne Smith
Currently experiencing a problem where the plastic molded bodies of tantalum capacitors are cracking during my SMT processing. Caught after our conformal coating process. I don't know where in the process they cracked. Currently running an exper
Electronics Forum | Thu Apr 01 09:10:55 EST 2004 | cyclopsn
We are currently using non clean paste and non clean flux in our manufacturing process. But recently our customer feedback that using a non clean process might cause flux blockage in via hole area and potentially might burn or explode the boards over
Electronics Forum | Mon Jul 16 09:53:36 EDT 2007 | ed_faranda
Yes, you can use lead-free parts in a leaded process. And the other is true as well, no-lead free parts in a leaded process. BUT, you should not use leaded parts through a non-lead wave solder process and of course, your board will not be RoSH.
Electronics Forum | Fri Aug 15 10:23:56 EDT 2008 | ck_the_flip
Ovens, and any other process for that matter, will ALWAYS vary. It's called process variation. I do Cpk (process capability) on my ovens. I track time-above-liquidus and peak temperatures. Statistics will validate how repeatable your oven is.
Electronics Forum | Tue Sep 09 16:04:25 EDT 2008 | allan99
I don't think so if your process is a just in time rework, you have just to develop a profile at your rework station for each component and also clean the place (board) properly. If your process is not a JIT rework, you must have to bake the boards,
Electronics Forum | Wed Sep 02 11:36:22 EDT 2009 | kpm135
Is this an established process that is just now exhibiting these problems, or is this a brand new process you're just setting up? What is the rest of your process like? What is done to the boards before you coat them? Water washed? Solvent washed? Sa
Electronics Forum | Sat Sep 05 23:15:32 EDT 2009 | prasadz
We have successfully implemented this dual Process You can use any printer that supports Board width 500mm. SMT Dual Process Maximum PCB Width should be (500-20 / 2 ) = 240mm Max (PCB width )Printer support = 500mm Top width + Bottom width
