Electronics Forum: profile and hp (Page 8 of 26)

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Jul 28 11:31:42 EDT 2008 | blnorman

Ideal situation is get a technical rep from the solder paste supplier. They know their paste better, and should be able to work out a profile based on their paste and your oven. Again, a technical rep, not the sales guy.

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Jul 28 13:21:50 EDT 2008 | realchunks

Do you have a Slim-Kic? You can run a profile and then do predictions from there. Very useful tool.

Time and temp in lead and lead-free reflow

Electronics Forum | Tue Jul 29 10:53:58 EDT 2008 | pcbbuilders

Some profiles can be difficult to get exactly, so I was wondering what effect a slight deviation might have.

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101

Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 12:06:27 EST 2008 | evtimov

Hi, it seems like a glue problem to me. If you don't have enough glue on SOT23, you have no contact and the part is holded only by the paste, which results bad in the waver machine. So first I would check is the glue amount under the SOT. The second

Nitrogen gas and Tombstone defect

Electronics Forum | Mon Nov 21 10:51:12 EST 2011 | scottp

I've never seen a good article with a definitive explanation - just speculation that the increased wetting forces due to nitrogen result in increased tombstones. My own experience is that nitrogen is a very minor contributor to tombstones and can pr

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Jul 28 16:48:54 EDT 2008 | pcbbuilders

my oven has a built in profiler, it works fairly well, but it can not predict changes. my main concern was about the time right before reflow. i know that's where the flux is activated and i was worried that i may be spending too much time at the tem

Time and temp in lead and lead-free reflow

Electronics Forum | Fri Aug 01 21:10:35 EDT 2008 | leo_dektec

You can keep only the 5th zone as the reflow zone. And lower the first two zones to keep a good ramping rate. Meanwhile,please note the ting temperature in software or control panel is not the exact temperature in your PCB, you'd better get a KIC or

Time and temp in lead and lead-free reflow

Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders

Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t

Hyper BGA and Super BGA

Electronics Forum | Tue Jul 06 19:45:03 EDT 2004 | ANDREW

Based on the attchment it looks like both are low profile and cater for high IO point.What are the challenges in running this 2 type of component?Is there any additional process required other than normal SMT for these 2 packages,like underfill ?


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