Electronics Forum | Mon Jan 19 23:18:56 EST 2015 | cspasol
Thank you mac. May I know what t/C's your using? Do you have any recommended High temp solder that we can buy? We already use Kapton, but it affects the curved on our profile data.
Electronics Forum | Mon Aug 14 04:00:25 EDT 2017 | sankarseptember
We check the TDK data sheet reflow profile condition. We check the PCB surface temperature the max temperature is 237.Anyhow We will confirm it by check temperature on TDK point
Electronics Forum | Tue Feb 02 14:53:56 EST 1999 | Tony
| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | | | Al, I have been using the same process as Justin recomendations. I have been verry su
Electronics Forum | Wed Feb 04 09:58:50 EST 2009 | dyoungquist
As was stated before, you need to have oven temperatures (profile) set such that you get good solder joints with the paste you are using. And definately run a profiler through yor oven to verify it is working properly. As for components, most data
Electronics Forum | Mon Jul 18 02:47:27 EDT 2005 | grantp
Hi, It sounds like your a little new at profiling, and can be difficult to do well. We purchased a KIC profiler that has software that will take your profile data and tell you the best oven temperature settings and conveyer speed to use. You need
Electronics Forum | Tue Feb 15 09:27:34 EST 2000 | Casey Scheu
Sal, This is a common problem experienced by several OEM's. It all comes down to heat. This is why the problem is corrected on your repair unit. I would suggest using a Slim Kic or Data Pac (mole) to thermal couple the IC prior to the reflow oven.
Electronics Forum | Mon Oct 26 17:04:30 EDT 2009 | stepheniii
IIRC the IPC spec for oven profiling says the thermocouple leads should not be more than one meter in length. I think when you can afford it, getting a data logger to go through the oven would be a good idea. But if you are going to use the very lon
Electronics Forum | Mon Feb 20 20:57:35 EST 2006 | Cal Kolokoy
The ramp sets the stage for flux activation, and if ramping in a linear fashion, burning off some of the volatiles, but yet preserving the activators. The ramp is also intended to preheat the SMDs to prevent thermal shock. Most solder paste data sh
Electronics Forum | Tue Jul 11 11:59:34 EDT 2000 | George English
Looking for some welcome advise again folks. We are currently using a reflow profiling software package which requires passing a data logging unit through the oven attached via thermocouples to a populated 'dummy' PCB. The problem is we have a very
Electronics Forum | Wed Feb 02 15:12:44 EST 2000 | Chung H. Park
Mr. Kim: The answer to your question depends on the type of mix you are dealing with. Here is the approach you should be taking to answer to your question yourself: 1. Establish the reflow process specifications for products. 2. Profile your p
.gif)
