Electronics Forum: reballing and problem (Page 8 of 65)

Skewed and popped components

Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt

Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.

0402's and Gluing.............

Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie

We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int

SPC and Wave

Electronics Forum | Thu Jul 14 11:52:16 EDT 2005 | davef

Sure you can use SPC charting on the wave setup parameters to warn of impending problems. Examples of useful points of analysis are: * Dwell * Temperature * Pot analysis Certainly there's a range of other process controls that could be monitored.

SPC and Wave

Electronics Forum | Fri Jul 15 10:56:19 EDT 2005 | pr

As Russ said, you do a DOE beforehand. BUT Maybe we are missing something, we do SPC after the wave (1/5) to catch defect trends and fix them with a minimum of inspection. If you are running a 2,000 piece pull, are you that confident that your origin

Immersion gold and BGAs

Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ

The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c

SMT optimization and improvement

Electronics Forum | Thu Jun 01 04:51:21 EDT 2006 | EC

Hi TS, Most of the machines will face this problem after been using few years.....I handling SMT equipments ( Fuji machine ) and process.....sorry if I have offened you...... Hi Jack, Firstly, you must able to tell which component having a high thr

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

SPC and Wave

Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian

A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th

Inspection and splicing

Electronics Forum | Tue Aug 21 08:34:03 EDT 2007 | rgduval

We have the same problems with cut/tape parts. But, we specialize in short-run prototypes, so I don't have much of a choice but to deal with it, and find a way to make it as easy as possible. We just demo'd a splice tool from Sierra Electronics (ww

Re: MoonMan and Tetras

Electronics Forum | Tue Apr 27 05:26:14 EDT 1999 | Charles Stringer

| | Hey MoonMan, | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop!

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