Electronics Forum | Thu Jan 11 00:52:12 EST 2007 | behrsam
Mario, I tried a couple of profiles. In all cases the preheat ramps fairly slow, while the reflow utilizes the radiative heater to speed to reflow as quick as possible. I tried a quick profile and a slower one. The quick has about 15-20 sec at pre
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Tue Jun 26 16:07:12 EDT 2018 | eduszapata29
Minami vacuum reflow is easy to maintain air tightness, and oxygen can be reduced to 50ppm or less by filling N2 gas. And generation of oxide film can be suppressed, and production in low oxygen environment is possible. In addition to the air tightne
Electronics Forum | Tue May 25 18:07:22 EDT 2010 | jlawson
Vacuum Soldering is mostly available with Vapor Phase Soldering systems as a option. Asscon / IBL / Rehm Thermal all offer this... Rehms system is unique as they offer in place solder and vacuum vs the other two vendors that move a PCB with Molten
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Fri Mar 02 08:52:20 EST 2001 | markkrmp
Are your voids looking like blow holes also? Is this only occurring on the solder joints of the Thru Hole components and Via's? Or does this happen on SMD pads? My experience is that we have seen this but only with some of our older PCB's which are
Electronics Forum | Sat Jun 22 21:06:27 EDT 2002 | jersbo
I agree with PJC.. The mention of 2 QFPs to wave = more than likely rework to remove bridges and a potential to scrap the board, 25mil isnt as bad as 20 or less.. but the potential is still very real.$$$$$$ reflow/reflow is my 2 cents with the possib
Electronics Forum | Fri Jan 07 09:56:04 EST 2005 | davef
Electroformed stencil suppliers follow. The describe the stencil production process on their sites. * Aplpha Metals [ http://www.alphametals.com/products/ stencils/pdf/PG_Electroform_Stencils.pdf ] * Chepaume [ http://www.chepaume.com/electroforming
Electronics Forum | Fri Jan 08 12:02:46 EST 2010 | jrr3434
This is probably a weird question. I have taken the chip wave out of my solder pot and was wondering if it is possible to put something in its place to take up the void and at the same time reduce the volume of solder? I noticed it takes longer to he
