Electronics Forum: reflow and golden (Page 8 of 51)

Golden Finger contamination with Solder after reflow

Electronics Forum | Wed Nov 15 07:21:58 EST 2017 | stephendo

You don't clean contaminated gold fingers so much as you replace them. I once had the "cleaning" solution. It totally dissolved the gold fingers so that they could be replaced.

Thermocouple calibration on reflow oven

Electronics Forum | Thu Apr 15 20:41:22 EDT 2004 | Ken

There are ledgitimate reasons for checking furnace calibrations, but let me clarify what that is. 1. TC's are not necessarily calibrted. Not unless you need "absolute" accuracy. TC's operate against a (non-linear) standard +/- a tolerance. Most

Golden Finger contamination with Solder after reflow

Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef

Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p

Golden Finger contamination with Solder after reflow

Electronics Forum | Tue Nov 14 08:52:07 EST 2017 | davef

If you think the problem is occurring in the box and it is wide spread, consider replacing your solder paste with your paste supplier. There are paste formulations aimed at the solder balling issue that some LF pastes create. On tuning your reflow r

IC marking unclear after pass reflow

Electronics Forum | Wed Apr 02 13:56:03 EDT 2008 | slthomas

So your golden board isn't a valid representation of your production material. I don't use AOI but it sounds like either you need a vendor that can guarantee the same part marking appearance as you originally programmed to (not likely) or you need a

IC marking unclear after pass reflow

Electronics Forum | Wed Apr 02 09:56:59 EDT 2008 | patsama_n

Every time to create new AOI program we must manual set at bright lighting level for each component. then this case we think the parameter of AOI setting it not concern for this problem due to the golden board that we use to confirm machine before st

Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong

Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB

As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter

Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold

Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.


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