Electronics Forum | Wed Nov 06 05:13:01 EST 2002 | Dreamsniper
Crystalline flux if it is really clear should not be a problem. We were using Amtech paste before and we have the same results. Sometimes we mistakenly see it as a dry joint because of the reflections from the lighting of our Metcal inspection system
Electronics Forum | Wed Feb 09 21:19:03 EST 2005 | Mrduckmann2000
Russ, We can not use a wave pallet, already went that route. We have parts next to the thru-hole pins and between thru-hole pins. I am going to try an experiment in the next day or so with solder mask. I plan to solder SMT parts on the back of se
Electronics Forum | Wed Dec 20 04:43:36 EST 2006 | greg york
Any decent flux would volatise off with the heat of the wave unless absorbed into the solder mask. Test this by trying to clean in alcohol or common solvent aerosol, if it does not clean then it is probably Mineral Salts from solder mask fillers. Ano
Electronics Forum | Thu Nov 30 16:14:33 EST 2006 | darby
Maybe ask your customer where they got this idea from? It is possible they may have even got this idea from some white paper or article where they are trying to explain something else and show drawings with no solder between the pad and lead. It may
Electronics Forum | Thu Sep 11 16:50:18 EDT 2003 | davef
Sure it's conceivable that thin HASL can cause tombstoning. Harkening back to the ample discussion in the fine SMTnet Archives, tombstoning is caused by an imbalance in solder surface tension between the two pads of SMT component. The source of thi
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Tue Feb 19 09:41:26 EST 2008 | slthomas
ECD sells the MOLE, and they sell both the Oven Rider and the Wave Rider to accompany it. The thing is, you can profile both an oven and a wave machine without either if you're willing to just solder your thermocouples to a board. The nice thing ab
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