Electronics Forum: reflow peak temp (Page 8 of 139)

reflow profile

Electronics Forum | Wed Feb 20 11:40:31 EST 2019 | bmalhi

Heller Oven comes with a profile pre-loaded so you can start there. RTS = Ramp to Spike. Basically a straight line from preheat to spike. Also known as “Tent” profile RSS = Ramp Soak Spike. This one creates a flat line around 150-180 degrees on th

reflow oven

Electronics Forum | Mon May 24 15:50:11 EDT 2004 | Rob

hi all What do you think about soldering pb-free in reflow oven (air) lenght 1,7m (5 zones top,bottom) with max zone temp. 300C? Do you think that this process will be stable? Our max PCb dimension 260x260 mm. When i compare different oven producer t

Incomplete reflow

Electronics Forum | Sat Apr 05 13:04:33 EDT 2014 | horchak

237C max is on the low end for SAC305, especially if you have heavy leaded components. I always went with 245C and above depending on the board design. I noticed the electrolytic caps. You need to check max temp with the manufacture on those. When I

reflow profile

Electronics Forum | Fri Sep 21 21:43:16 EDT 2001 | dougk

We're used to placing the theromcouple on the solder joint and securing it with thermally-conductive UV adhesive. It's quick & easy to apply, and I've only seen a couple degrees difference from high-temp solder technique. Thoughts?

Vibrating reflow

Electronics Forum | Thu Sep 18 07:38:50 EDT 2003 | cmiller

That was the method we were going to try. We have the circuitry from a sifter we make. The sifter works with a regular speaker but I could not find one working at a high enough temp for an oven. Then I lost interest or got busy.

Incomplete reflow

Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569

We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex

PCB Pad become brownish after IR reflow

Electronics Forum | Thu Sep 17 04:48:51 EDT 2009 | grahamcooper22

The colour you see on the pads is tin/copper intermetallic layer. In your reflow the immersion tin coating and the copper pad underneath react to form in intermetalic layer. The effect is worse the hotter the pcb or area of the pcb gets. In IR reflow

Temp delta limit across BGA in reflow

Electronics Forum | Wed May 19 07:38:42 EDT 2004 | Bob L.

I'm trying to help one of our remote sites solve a problem with a warped PBGA. The corners are lifted, creating columnar joints and the central balls are sometimes shorting. I've verified that it's not popcorning and I've got samples going to the l

Profiling - suspect flux burn out before reflow trouble shooting

Electronics Forum | Thu Jul 03 19:27:54 EDT 2008 | proy

5 Zone HVA70 Oven Board 6 layer, 10" x 13" lots of space, most critical is 100 pin QFP AIM Water Soluble 487 Tin Lead paste on SN100C HASL boards This board is giving me disproportionate grief! I am running 23 in / min which gives me about 3.1 mi

Component ( Connector ) drop during secondary reflow

Electronics Forum | Thu Dec 06 07:59:00 EST 2018 | msbettyhunt

Hey, What would be the peak temp. ?


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