Electronics Forum | Thu Oct 26 14:51:46 EDT 2000 | eramirez
Currently I am running a very dense PCBA using a PCB less than 20 mils thick. We have two facilities running this product. One is using Nitrogen during reflow one is not. What is the advantage and disadvantages of using Nitrogen during the reflow
Electronics Forum | Wed Oct 17 17:43:27 EDT 2001 | davef
2) Open time: A 15-minute queue between paste, place, and reflow SB fine, assuming humidity is not too great. 3) Wash temperature: Yes. A wash temperature of 130-140�F SB fine. 4) Reflowed board was left too long prior wash: Are you washing: * After
Electronics Forum | Mon May 24 15:50:11 EDT 2004 | Rob
hi all What do you think about soldering pb-free in reflow oven (air) lenght 1,7m (5 zones top,bottom) with max zone temp. 300C? Do you think that this process will be stable? Our max PCb dimension 260x260 mm. When i compare different oven producer t
Electronics Forum | Wed Oct 17 13:02:41 EDT 2001 | Yngwie
We are running Clean process. solder beadings were found after the wash process. Weird eh!! It's true.. Details: 1)wash pressure ? No shadowing effects from high profile component. It also happened on the component's body of the 1210 & 0402 caps whi
Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569
We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex
Electronics Forum | Tue Jul 28 14:34:47 EDT 1998 | upinder singh
Hello everybody. Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at the
Electronics Forum | Mon Apr 17 18:42:32 EDT 2000 | Russ
Murad, I have just completed a switch over in our facility to no-clean. We used Alpha 609 and 857 paste and wave flux respectively. We currently use Alpha UP78 paste, NR330 wave flux, NR205 liquid flux for touchup and cleanline 7000 wire solder as
Electronics Forum | Wed Oct 17 19:12:32 EDT 2001 | scott
Dave's right! Wash the boards RIGHT AFTER reflow, don't let that residue harden. Then you turn around and cure that stuff during the second reflow by not performing the first wash???? wow.... By the way, are you having any problems with white resi
Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef
Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re
Electronics Forum | Sat Jul 29 09:01:08 EDT 2006 | davef
Well, a "reflothermal recipe" is a typo. It should read "reflow thermal recipe". Sorry for the confusion. Most people call this THE PROFILE. We think a profile is the output of a profiler when it portrays the result of a reflow recipe. We're gue
