Electronics Forum | Wed Apr 13 21:17:18 EDT 2022 | stephendo
If it was ROHS, I would say that the pads are definitely dissolved away. And it sounds like that is the case here. Your best bet is if it is class 2 and the barrels are at least 50% then push for them to be accepted. If you are trying for more barr
Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Fri Jun 16 11:28:53 EDT 2000 | Boca
Solder 'follows' heat. 1. Preheating is a great idea, use a baking oven to get the whole assembly up to temperature, use the preheaters in your wave solder machine (without wave) to preheat the assemblies ... 2. Or use the biggest soldering iron
Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea
A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Wed Aug 25 07:53:08 EDT 1999 | Scott Davies
| | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | Any help would be appreciated. Thanks. | | | Most common reason is uneven heating where one side of the com
Electronics Forum | Wed Aug 25 09:48:28 EDT 1999 | Larry Koens
| | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | Any help would be appreciated. Thanks. | | | | | Most common reason is uneven heating where one side
Electronics Forum | Thu Jul 23 13:11:13 EDT 1998 | Gestapo Allen
I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the rew
