Electronics Forum | Fri Jul 23 10:47:31 EDT 1999 | Mark D. Milward
There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing th
Electronics Forum | Tue Mar 01 10:50:32 EST 2005 | pr
I think the 1st option would be the best. I have found that a touch up person WILL TOUCH UP SOMETHING, regardless of the electrical needs of the board. This leads to a lot of unnecessary rework of joints. I would hope QC is tracking the defects and t
Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj
The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i
Electronics Forum | Fri Mar 27 12:46:23 EDT 2020 | unisoft
Unisoft has been import gerber only for years to setup assembly, aoi machines, etc. *** Help for Importing GERBER only files for used in programming Assembly, AOI, Test, Selective Soldering machines (X/Y Center, Rot, Part#). Also allows you to cre
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Fri Jul 12 13:02:22 EDT 2002 | rocco
Hello !! One basic question ....Which pitch is considered micro BGA ? Thanks !!
Electronics Forum | Thu Jan 27 11:45:04 EST 2005 | Mark
Based on the components mentioned, it sounds like you need a soldering station rather than a bga rework station. The equipment mentioned would allow you to rework fine pitch QFPs and BGAs. Reworking an sot-23 using one of those systems is inefficie
Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef
Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.
Electronics Forum | Thu Jul 08 23:52:24 EDT 2021 | tey422
I would suggest getting KE-2060 or KE-2080 instead. It has better camera and easier programming if you are working with fine-pitch components such as QFPs & Micro BGAs.
Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
