Industry News | 2016-02-17 17:38:34.0
The Surface Mount Technology Association and Questex LLC announced today the finalized agreement to co-locate the SMTA International Conference and Exhibition (SMTA International) with Sensors Midwest.
Industry News | 2016-07-19 18:58:32.0
SMTA announced the keynote speaker for the 2016 SMTA International technical conference September 25 - 29, 2016 in Rosemont, Illinois.
Industry News | 2017-02-05 10:18:08.0
The SMTA is pleased to announce its 2017 Educational Programming that includes conferences, webtorials and webinars, certification program and online training courses.
Industry News | 2012-01-10 19:20:12.0
IPC announced the winning research papers selected in the 2012 IPC International Academic Paper Competition.
Industry News | 2003-04-24 08:16:54.0
http://www.smta.org/news/smta_calendar/calendar.cfm
Industry News | 2010-10-20 22:35:11.0
Apple Computer Co-Founder Steve Wozniak will deliver the opening keynote address at IPC APEX EXPO™ on Tuesday, April 12, 2011, at Mandalay Bay Resort & Convention Center.
Industry News | 2012-01-10 19:29:28.0
Following two years in development, a draft of the industry’s first standard on the assembly of solar panels, IPC-8701, Visual Acceptance Criteria for Solar Panels - Final Module Assembly, was released today for industry review and comment. IPC - Association Connecting Electronics Industries® is seeking industry comments through February 9, 2012.
Industry News | 2013-05-23 20:06:11.0
The SMTA proudly announces 33 engineers have received SMTA Certification for SMT Processes since May 2012. The SMTA Certification program is unique as it recognizes and certifies the entire SMT assembly process at an engineering level.
Industry News | 2013-07-19 11:27:23.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 10th Annual International Wafer-Level Packaging Conference.
Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
