Electronics Forum | Thu May 09 17:24:11 EDT 2002 | davef
First, SM-782 elates to surface mount pads. So, expecting to find PTH design rules there is a bit of a stretch. Search the fine SMTnet Archives for similar threads. For instance here�s one from last week: http://www.smtnet.com//forums/index.cfm?fu
Electronics Forum | Wed Mar 24 23:12:48 EDT 2021 | grahamcooper22
0.66 area aspect ratio...so for example...if the device is 0.5mm pitch QFP, the pcb pad may be 12 thou wide..make the aperture 9 to 10 thou wide...and reduce it's length by 10 % overall compared to the pcb pad.... Depending on device pitch, select ap
Electronics Forum | Tue Mar 23 10:22:17 EST 1999 | Chrys Shea
| Are there many of you who are soldering through hole parts in your surface mount reflow oven? How repeatable is the process? Do you need to touch up a lot after reflow? We don't do long runs maybe 200, 300 boards max. Can you just screen print
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Fri Oct 15 08:01:05 EDT 2004 | jmedernach
Hi Matt, You've got an interesting problem. Sounds like something from an X-Files episode but it's still interesting. In your posting, you say that the paste is "there" after screen printing. Release isn't the greatest with a 0.012" round aperture
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
Electronics Forum | Thu Jun 17 19:40:11 EDT 1999 | Scott Cook
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Thu Jun 17 19:40:27 EDT 1999 | Scott Cook
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Thu Jun 17 19:41:29 EDT 1999 | Scott Cook
| | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads.
Electronics Forum | Tue Mar 23 04:07:44 EST 1999 | Scott Davies
Rob, We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. - Apply adhesive dots to selected