Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Sun Jun 07 06:05:37 EDT 1998 | Bob Willis
| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b
Electronics Forum | Thu Dec 23 15:29:48 EST 1999 | Glen Robertson
Mike - I'm not in the EMS business, but I suspect most of them are very reluctant to reveal much about their quoting process. You might want to try some of the third-party data suppliers like Ceeris (www.ceeris.com), and you can also check the C
Electronics Forum | Sat Nov 06 14:58:45 EST 1999 | Gary Moravchik
Assuming you are using Sn63/Pb37 solder paste, have you tried using a lower temp melting point solder paste for the second pass? For example, use 63/37 for first pass and a Bi58 compound solder paste for the second pass. If I recall, Bi58's melting
Electronics Forum | Mon Nov 01 22:16:04 EST 1999 | Dean
Without a detailed description of the suspect parts It is difficult to pin-point the exact solution to your process problem. However, whenever possible avoid non-value added additions to your current process. Here is the reality of the situation:
Electronics Forum | Wed Nov 17 09:51:25 EST 2004 | AS
I'm looking for advise on setting up a prototype station for smt (we are currently outsourcing smt production, but have a need for rapid in house prototyping). The station must be able to handle only single sided boards with components no smaller th
Electronics Forum | Wed Nov 17 15:04:27 EST 2004 | russ
SMT assembly, First, you must utilize paste otherwise the parts will not stay put. Do you have any leaded devices such as QFPs or SOICs? Dispensing paste by hand is very difficult and time consuming for these types of parts. You can either dispense
Electronics Forum | Tue Nov 27 20:48:31 EST 2007 | davef
Shy: You say, "I've already done some evaluation to reduce the heigh of the glue but it fails at wave solder which cause the component to be drop/missing." Based on your evaluation, questions are: * What is the relation between component standoff an
Electronics Forum | Wed Jul 20 03:10:45 EDT 2011 | umar
I have mount the 8 pcs SEVEN SEGMENT LEDS on the PWB side at SMT Process, after reflow the board test at customer side and facing some issues which is missing segment and also one segment founded dimmers compare to other segment. Data sheet of LEDs
Electronics Forum | Tue Nov 27 07:51:21 EST 2007 | shy
is there any gap between the pad and terminal if we place the glue? Btw, my practice to print solder pate then punch glue then PNP component and finally reflow. Also we find drop/missing chip after wave eventhough we glue the component.
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