Electronics Forum | Thu Feb 17 15:00:25 EST 2005 | austinj
I am working on fixturing to keep the pcb/panel from "floating" in the oven. The problem is cold solder/non-wetting on all components. My thoughts lean towards the thin pcb not retaining the "preheat temps" for proper soak/reflow. Any thoughts about
Electronics Forum | Fri Feb 18 11:30:27 EST 2005 | austinj
Thanx aj and Russ. I will verify my ramp up/down degC/sec and the soak zone peak temp. Fluxes could be burning off prior to activation. I have found access to an old thermal data logger to help verify the Heller thermocouples. I will post updated fi
Electronics Forum | Thu Mar 03 09:29:12 EST 2005 | jdengler
This sounds like you are using a straight ramp profile. For this type of an assembly you may need to use a soak type profile. Most solder paste providers show you both types of profiles that work best with that paste. I would try using that profil
Electronics Forum | Mon May 09 14:36:49 EDT 2005 | driscolj
We've had similar problems with Indium 6.2 water soluble paste. We reduced our voiding by implementing a longer soak and lower peak temperature.
Electronics Forum | Thu Jul 07 17:08:28 EDT 2005 | Inds
how fast are you ramping your profile..and how long are you soaking it.. are you giving enough time for the flux to get activated...
Electronics Forum | Wed Sep 14 08:01:44 EDT 2005 | Rob
It's a functional test over a number of hours/days designed to give an accelerated life test, to detect possible faults, intermittants etc. You tend to run the boards in a hotter & harsher environment to reduce the test cycle time.
Electronics Forum | Wed Nov 30 21:21:57 EST 2005 | Kwon Jun Kwak
any use the ramp, soak and spike profile methode, or with lead free using the straight ramp approach? What most paste manufactures recomended?
Electronics Forum | Thu Dec 01 11:46:41 EST 2005 | pjc
FYI: Most Sn/Pb and Pb Free solderpastes today are designed to run both a ramp-soak-spike or ramp-spike profiles.
Electronics Forum | Thu Mar 09 16:21:53 EST 2006 | geocominc
Ramp or Soak give us same Deta T (from 35 to 40).All probes are tested o.k.Should we pump in more heat upfront in order to warm up heavy loaded ICs like PLCC64 or Change blower speed? or Slow down line?
Electronics Forum | Fri Mar 10 12:15:52 EST 2006 | geocominc
Increase Soak time & Slow down line did reduced Delta T by 10+,Fans are at max - Both High -getting closer to target now.Great idea.still more to do .Thanks for advices.
