Electronics Forum | Thu Jan 24 11:47:15 EST 2002 | Joe B.
Are there any formalized standards for the properties of solder balls? Example properties: sphericity uniformity(variance) of the ball size distribution surface roughness surface oxidation or other surface treatments/contaminants ?? As someone rela
Electronics Forum | Mon Sep 22 15:21:19 EDT 2008 | davef
While you're waiting for others to reply, search the fine SMTnet Archives for postings like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30878
Electronics Forum | Tue Sep 23 20:56:08 EDT 2008 | davef
For additional information, download IPC-7526 - Stencil and Misprinted Board Cleaning Handbook http://www.ipc.org/html/IPC-7526.pdf
Electronics Forum | Thu Sep 25 17:44:37 EDT 2008 | gregoryyork
strongly agree dont wipe at all, we make an air operated cleaner which blows the powder off while immersed in solvents to break up the flux. cheap and effective as long as you dont wipe first
Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef
Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla
Electronics Forum | Tue Sep 23 07:27:31 EDT 2008 | realchunks
Do not wipe the board at first before putting it in your cleaner. It will leave more paste in your tank, but you won't smear it into every corner of your solder resist. We found that only our stencil cleaner would clean a board properly and leave n
Electronics Forum | Tue Sep 23 14:13:29 EDT 2008 | slthomas
In piggy back on Chunks' comments, what you might wipe it with can be the problem. Alcohol absorbed by the solder paste inhibits the effectiveness of some cleaning chemistries, and driving it into the nooks and crannies exacerbates the problem. If
Electronics Forum | Mon Jan 28 20:06:52 EST 2002 | davef
Sounds like an interesting project. In Euroland and Japan, there are political moves with no scientific basis afoot to exclude lead from electronic products. There is a HUGE body of knowledge on the topic. For instance, Electrochemical Publication
Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
