Electronics Forum: solder and balls and 0.13 (Page 8 of 17)

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:19:07 EST 2004 | Evtimov

Hi Bryan The answer is in the paste compozition. Balls of the BGA are usually made by eutetic solder paste.

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7

My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a

BGA ball and PCB pad

Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe

OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Fri Jan 15 07:23:14 EST 2021 | denism

Also, solder splashes can be due to contamination, for example, on the terminals of components. In the past, had a problem with solder splashes on a seemingly standard SMD component. The reason was the incorrect nickel plating process of the componen

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Tue Jan 19 10:18:58 EST 2021 | grahamcooper22

Hi, try a low spitting cored wire...something like ALMIT SR-LA cored wire...or SR-LA SUPER...it eliminates flux/solder spitting during soldering.

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Fri Dec 11 08:56:08 EST 2020 | SMTA-64304223

One of the common causes of solder ballin is also outgassing from the boards have your tested the board for outgassing? Bob Willis

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Fri Dec 11 13:06:54 EST 2020 | johndep7

I haven't, that is a good idea, I was reading about the chance of that earlier but I was not sure. The best way to eliminate is to bake the board?

BGA ball and PCB pad

Electronics Forum | Thu Feb 12 10:19:46 EST 2004 | Bryan

Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the perf

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:32:47 EDT 2007 | davef

Haris: On your soldering issues, we don't know the make-up of your component. We don't know the type solder balls on the component. We don't know the solder paste you plan to use. Your component and paste supplier are better sources for this type o

Solder beads and wave soldering

Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac

Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a


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