Electronics Forum | Fri Aug 14 08:59:51 EDT 1998 | Dave F
| | | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | | Xingsheng | | Xingsheng: Welcome. | | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | | Web resources: htt
Electronics Forum | Fri Aug 14 07:27:42 EDT 1998 | Earl Moon
| | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | Xingsheng | Xingsheng: Welcome. | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | Web resources: http://www.pw
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics
This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?
Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb
On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
