Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek
Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit
Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew
We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Fri Jan 28 12:18:32 EST 2005 | Chunks
Your best bet is to do a decision making matrix. Each company has so many different criteria�s it's hard to pick out which one might be important to yours. Simply pick out your top 5 paste manufactures. Next decide what your "Eliminators" are - th
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory
Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W
Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan
| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil
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