Electronics Forum | Tue Nov 19 21:38:39 EST 2019 | zack
Hello, The first thing that you need to do is to make process mapping about this incident, so you can exactly determine all factors and observable changes happened during 2 weeks of timeline difference. According to my experience, if all equipment
Electronics Forum | Tue Nov 12 09:04:21 EST 2019 | mario85
Hello Guys, I'm new here. I am smt process engineer in new company located in Poland. I am responsible for whole smt line, so I have a lot of problems at the beginning :). I would like to ask about few things. The topic is solder balls. I produced s
Electronics Forum | Thu Nov 14 21:57:47 EST 2019 | sssamw
yes, first of all you need confirm if solder ball around solder pad has same location, if so then check squeege if has worn area or not at same location. If not, please check sodler paste itslf to see if dry a little, if so all paste could be a littl
Electronics Forum | Wed Jun 30 10:24:27 EDT 2004 | K
We find keeping the work environment at about 22degC and humidity to about 40-50% is the best way to control the solder balls. Before we took measures we were out of control with solder balls especially in the summer months. We run aqueous solder thr
Electronics Forum | Fri Jul 02 17:08:58 EDT 2004 | blnorman
We used to use Alpha paste. Every summer we had solder ball problems when the humidity rose. Time frame sounds like this is something to check in to.
Electronics Forum | Mon Nov 18 04:04:43 EST 2019 | ramesh_10377
hi initially, as per PCB design and gerber file of PCB we got 5 mil stencil, during process observed lot of solder balls (70-80%), then we decided to go for 4 mil stencil with c-cut. now the problem is reduced and still solderball exists which is a
Electronics Forum | Mon Jul 28 13:08:28 EDT 2008 | gabriella
Hello everyone, thanks for the feedback. Now I am sure it is too much solder paste. It seems that the pads are a little bit bigger than they should be, so I will probably need an aperture reduction more than 10%.
Electronics Forum | Thu Jun 24 02:31:24 EDT 2004 | yukim
Currently we are having a lot of solder balls, after a few hours of continous production. This is how we work: load new solder paste at the beginning of the shift, less than 500grms. Then, the operator loads new solder paste periodically, every 3 to
Electronics Forum | Thu Jun 24 23:00:36 EDT 2004 | yukim
Tried with several lots of solder paste, manufactured in Feb and March this year. Work ambient: 25C, 60~70%. Is this humidity too much? I'll reduce the ramp in our profile. One change: We changed the conveyor motor in our reflow oven just before the
