Electronics Forum | Wed Oct 13 12:54:44 EDT 1999 | Dave F
Mikeh: You can't let that stuff get to your carbon bed. Literally, you can watch your bed die. The clay coats the carbon, entombing it. I've heard talk of using a RO filter as a front-end buffer to the recycling system, but know of no one who has
Electronics Forum | Fri Jan 29 16:17:13 EST 2021 | donnie15
The impact is low on larger pitches and pad sizes. as things get to the .4mm pitch the pad differences start affect your ball size and yields. The trace size going into the pads and the solder mask relief can cause some odd shaped pads with signif
Electronics Forum | Fri Jan 22 16:03:17 EST 2021 | SMTA-64387124
Does anyone see any issues in mixing SMD and NSMD pads within one BGA footprint. We have high current pads which we want to make SMD and the other signal pads to be NSMD
Electronics Forum | Tue Feb 09 16:53:06 EST 2021 | SMTA-64387083
The size of the pad changes among the two. A solder mask defined pad will always be larger than a copper defined by your mask expansion setting. This will affect paste volume, if your standard paste aperture is designed for copper defined pads you m
Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
Electronics Forum | Thu Oct 17 00:34:59 EDT 2019 | jani
Hi, We have solder reflow use with water soluble flux and Tin/lead process. There is special glass component which needs to mask during reflow soldering and wash flux+solder mask post soldering. The existing solder mask does washes off. But leaves
Electronics Forum | Mon Nov 08 17:47:58 EST 2004 | davef
Russ: On "usually get some mask material from our board house. It cures with heat so it works really well in our applications.": We're unsure about the type of mask that you are using, but be careful [we used to do this, also]: * Final cure of the L
Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer
| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit
Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon
| | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with
Electronics Forum | Tue Aug 09 10:38:45 EDT 2005 | SuMoTe
Water soluable dots will wash off after reflow. A water soluable liquid mask will work as well. dots are better for defined (round)holes, whereas the liquid mask works well with odd shapes.
