Electronics Forum | Fri Feb 19 14:43:46 EST 1999 | Nithy
We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not be
Electronics Forum | Wed Oct 13 14:27:08 EDT 1999 | mikeh
Dave F, We are currently using a latex based ambient/thermal cure material that is applied by hand or automated dispensing equipment. Printing is an option for us, but we have not had much luck with this particular material. The mask is peeled off a
Electronics Forum | Thu Oct 14 06:00:49 EDT 1999 | Graham Naisbitt
The latex should not influence your closed-loop filtration - unless of course it falls off during cleaning. The issue would be with water soluble materials. As Dave (hi Dave) said, the clay based version of these will clog/blind/knacker your carbon
Electronics Forum | Thu Oct 14 23:19:25 EDT 1999 | Dennis O'Donnell
Water soluble masks are great in my book. After having used the latex type, I found that the water soluble will save a lot of time. I dont't use a closed loop system, but I do have a filter on my discharge line. I have not experienced any filter c
Electronics Forum | Wed Oct 13 12:54:44 EDT 1999 | Dave F
Mikeh: You can't let that stuff get to your carbon bed. Literally, you can watch your bed die. The clay coats the carbon, entombing it. I've heard talk of using a RO filter as a front-end buffer to the recycling system, but know of no one who has
Electronics Forum | Fri Jan 29 16:17:13 EST 2021 | donnie15
The impact is low on larger pitches and pad sizes. as things get to the .4mm pitch the pad differences start affect your ball size and yields. The trace size going into the pads and the solder mask relief can cause some odd shaped pads with signif
Electronics Forum | Fri Jan 22 16:03:17 EST 2021 | SMTA-64387124
Does anyone see any issues in mixing SMD and NSMD pads within one BGA footprint. We have high current pads which we want to make SMD and the other signal pads to be NSMD
Electronics Forum | Tue Feb 09 16:53:06 EST 2021 | SMTA-64387083
The size of the pad changes among the two. A solder mask defined pad will always be larger than a copper defined by your mask expansion setting. This will affect paste volume, if your standard paste aperture is designed for copper defined pads you m
Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
Electronics Forum | Thu Oct 17 00:34:59 EDT 2019 | jani
Hi, We have solder reflow use with water soluble flux and Tin/lead process. There is special glass component which needs to mask during reflow soldering and wash flux+solder mask post soldering. The existing solder mask does washes off. But leaves
