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IPC Issues Call for Papers for Third Annual IPC High Reliability Forum

Industry News | 2018-08-29 19:35:22.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC High Reliability Forum to be held May 14–16, 2019 in Hanover (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

IPC And NPL Team Up To Solve Industry Process Issues With Free Defect Clinic At IPC APEX Expo 2011

Industry News | 2011-02-09 14:50:49.0

Manufacturing and quality engineers looking for solutions to process challenges will have an additional resource for answers with the new Process Defect Clinic at the IPC APEX EXPO conference and exhibition, April 12–14, 2011, in Las Vegas. Sponsored by IPC and the National Physical Laboratory (NPL), the free clinic will be held in booth 217 on the show floor to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.

Association Connecting Electronics Industries (IPC)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO 2014 TECHNICAL CONFERENCE SPOTLIGHTS CHANGING TECHNOLOGIES

Industry News | 2014-02-03 18:00:07.0

Changing technologies that are driving the electronics industry will be center stage throughout the IPC APEX EXPO® technical conference, which takes place Tuesday, March 25 to Thursday, March 27, 2014, at the Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

IPC Welcomes New Technical Education Program Manager

Industry News | 2019-01-14 19:30:42.0

IPC -- Association Connecting Electronics Industries® announces the addition of Brook Sandy-Smith as technical education program manager, to its staff at IPC headquarters in Bannockburn (Chicago), Ill.

Association Connecting Electronics Industries (IPC)

IPC Honors Best Technical Papers At IPC Apex Expo 2011

Industry News | 2011-04-20 21:19:17.0

IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing

Industry News | 2012-05-23 14:18:26.0

Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing

Association Connecting Electronics Industries (IPC)

IPC and CALCE Present 7th International Symposium on Tin Whiskers Event to Feature Experts from CALCE, Lockheed Martin and Other Leading Organizations

Industry News | 2013-10-01 18:21:25.0

IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)


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