Electronics Forum | Fri Aug 13 13:50:53 EDT 1999 | Brian Wycoff
| | | | | | Hello | | | | | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | | | 100 du
Electronics Forum | Sun Oct 10 18:53:04 EDT 1999 | Dreamsniper
| | | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | | | PCB is FR4 | | | | Solder Mask is LPI | | | | Reflow and W/S Profile =
Electronics Forum | Thu Oct 18 18:39:15 EDT 2001 | davef
Responding to your questions ... RELIABILITY OF 1% SILVER SOLDER PASTE: It�s as good as the next solder paste, all other things the same. Look at your back articles by Jennie Hang in SMT magazine. I want to say she wrote an article on the topic i
Electronics Forum | Fri Apr 30 09:20:09 EDT 1999 | Chrys Shea
| Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | My question's are really : | how is the printabilit
Electronics Forum | Fri Apr 30 11:03:27 EDT 1999 | Wade Oberle
| | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | My question's are really : | | how is the
Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee
| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Wed Jul 21 10:05:22 EDT 1999 | Mark Quealy
| | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk p
Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
