Electronics Forum | Thu Apr 17 13:35:49 EDT 2003 | davef
A-610 talks to acceptable voiding.
Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef
While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.
Electronics Forum | Tue Sep 04 02:28:17 EDT 2007 | philip_yam
Any one has experience over solder voids in oscillator capacitor joint could result in high phase noise during the digital performances test? The noise signal was gone after solder touch up. What could be the root cause of the high phase noise?
Electronics Forum | Wed Apr 16 11:20:31 EDT 2003 | russ
What was the original complaint? when you say solder wicked onto top of capacitor do you mean it was dewetted from the board and only on the cap? What type of device showed voiding? how bad was it 20%,50%? I have found that the paste type seems to
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Thu Apr 17 18:18:34 EDT 2003 | davef
We undoubtedly will take you up on that offer. Please email contact information.
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Electronics Forum | Thu Apr 17 13:02:28 EDT 2003 | Takfire
Thanks Dave! What level of voiding is acceptable? Would you please let me know if there is an EIA or other industry standard detailing solder joint quality? I will begin researching the background information you provided. Thanks again for your kin
Electronics Forum | Mon Sep 28 12:55:37 EDT 1998 | Manish Ranjan
Hi Everyone Does anyone has any insight regarding the void formation in the solderbumps during wafer bumping by electroplating. Someone told me that it could be mainly coz of the alloy concentration being incorrect. Any suggestions, corrective action
Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire
Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r
