Electronics Forum | Wed Aug 05 11:08:36 EDT 2009 | spitkis2
Hi, This may be a bit off the subject but thought I'd ask just in case. I am looking to identify a process / equipment for attaching solder balls to flip chips. Solder balls are 75 microns in diameter. With BGA's there are reballing kits that use
Electronics Forum | Fri Jul 24 23:20:11 EDT 2009 | umar
Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?
Electronics Forum | Tue Oct 28 09:24:10 EST 2003 | davef
Running a soldered BGA through a wave solder pot is very risky: * 230-240*C temperature of the pot could damage the device. * Solder in the pot will certainly cause bridging between BGA solder balls. * Solder in the pot could melt BGA solder balls.