Electronics Forum | Thu Jan 02 07:04:57 EST 2020 | dontfeedphils
Pretty large solder-ball. Looks like it may have come from the ground pad since it's so large, in which case I would reduce the print coverage on the middle/ground pad and see how it works for you. You verified that these parts have the groundpad a
Electronics Forum | Fri Mar 03 09:48:06 EST 2000 | Wolfgang Busko
I have heard about it. The main reason is to save money. The problem is, or better is said, that the mixing isn�t that simple for you got have a homogen paste afterwards and the solderballs shouldn�t be deformed in size so that problems during printi
Electronics Forum | Sat Jul 01 04:22:09 EDT 2000 | Sal
I have two questions 1. How do I control the skewing of FETs/power regulators ? ( the one's with the big rectangular pad and two smaller one's for the leads).If I go 1:1 with the apertures I seem to get solder balling and when I tryed to minimise th
Electronics Forum | Fri Mar 03 09:48:06 EST 2000 | Wolfgang Busko
I have heard about it. The main reason is to save money. The problem is, or better is said, that the mixing isn�t that simple for you got have a homogen paste afterwards and the solderballs shouldn�t be deformed in size so that problems during printi
Electronics Forum | Sun Oct 10 17:57:48 EDT 1999 | JohnW
Folk's, I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. I was wanting to do a straw poll on you guy's as to the type of resist's you are using Glos
Electronics Forum | Mon Oct 11 13:08:29 EDT 1999 | Dave F
| Folk's, | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | I was wanting to do a straw poll on you guy's as to the type of resist's you are us
Electronics Forum | Tue Sep 21 04:00:27 EDT 1999 | Wolfgang Busko
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | We use 6 mil lasercut stencils with 15% reduction and th
Electronics Forum | Wed Sep 08 16:44:15 EDT 1999 | Rob Jankowski
I am wave soldering a single sided through hole PCB array with (6) .040" round diameter pins that sit .5" off the PCB, and .080" apart. The problem being experienced is that solderballs are appearing on the end of the pins. I have tried decreasing
Electronics Forum | Sat Aug 07 11:47:47 EDT 1999 | JohnW
| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi
Electronics Forum | Sat Apr 10 01:11:37 EDT 1999 | forest
Our company is going to use BGA(1.27mm pitch) But I have heard of troubles with P-BGA. It is that cracks occured between solderball and gold plating of PCB during ICT(incircuit test). We know that gold plating of PWB is not good for BGA, so we decide
