Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup
Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or
Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
Electronics Forum | Tue Oct 31 22:09:25 EST 2006 | davef
The is a serious concern of lead contamination of leadfree solder connections. For background, search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30307
Electronics Forum | Tue Oct 31 19:41:38 EST 2006 | Dhanish
Can someone advise if there is any risk if we use lead-free alloy wire during rework for Leaded Process?The reason for this proposal is to only have one type of solder wire being used in the line.This will eliminate any possibility of leaded wire bei
Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef
Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Wed Jul 27 03:50:51 EDT 2005 | aj
Crishan, I am not familiar with the machine you mentioned. Do you use selective solder pallets through a wave process or is the machine a selective soldering machine (ie. where the board is moved to the solder fountain) No matter what the process
Electronics Forum | Fri Jul 08 07:17:15 EDT 2005 | davef
There are no bargans in soldering. Talk to a reputable supplier. Based on your product, you need to decide: * Type of flux * Solder alloy
Electronics Forum | Wed Jul 27 18:41:48 EDT 2005 | crishan
Aj, You are correct, we use pallets to hold the motherboard, an X-Y table then transports the pallet through preheat section to the solder bath. I will check out your recommendations on the solder alloy. Supplier is not willing to share PPM data o
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