Electronics Forum | Wed Jul 10 16:34:23 EDT 2013 | hegemon
Preheating is critical in Vapor Phase Soldering. One trick that is done is to use the "soft vapor" area just above the soldering vapor, some machines can pause just before going into the soldering vapor. Using that pause above the vapor to continue
Electronics Forum | Fri Jan 19 13:31:14 EST 2007 | lit51
Is the failure just out of tolerance or is it non functioning? For tolerance problem, compare the x-rays of the good and bad units. It will take a very high resolution x-ray to spot the differences. Changes in capacitance values can occur based on
Electronics Forum | Thu Aug 20 00:16:56 EDT 2009 | padawanlinuxero
Hello I am having a problem with the flux in the wave solder, I am using a sonoflux 9000 this machine uses a air knife to spray the flux, it creates a mist that when hits the air knife pulls the mist up to the pallet where the board is, but for som
Electronics Forum | Wed Jul 10 14:29:27 EDT 2013 | isd_jwendell
You wouldn't have a very good profile if you went straight from room temp to vapor temp (_-). The chamber should preheat the board before using vapor to melt the solder.
Electronics Forum | Mon Aug 12 15:56:13 EDT 2013 | pjchonis
Vapor phase soldering systems by Asscon are characterized by special designed heating modules. The thermal mass of the heating modules is designed so that a completely delay-less and direct regulation of the heat/flow/energy transfer to the soldering
Electronics Forum | Fri Dec 01 09:29:36 EST 2017 | kojotssss
Hello. We have a problem with QFN type. Component is elevated. Stencils are reduced. Vias is without holes. What are the solutions to fix the fault. Look at the photo. Attachment: https://drive.google.com/open?id=1OIgaXUz2yoKP3fWZg2rUsrmZMBWidk6_
Electronics Forum | Fri Jan 18 12:34:14 EST 2013 | duchoang
Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste. The problem is at LGA design.The pad size is alot bigger than BGA. They are totally flat and do not have balls/spheres which melted and collapsed thr
Electronics Forum | Wed Feb 23 22:38:28 EST 2005 | davef
We: * Cure 1B73 according to spec in a heat box, like a Blue-M * Clean nozzles [one set in use, one set being cleaned] in thinner in a bronson ultrasonic cleaner * Haven't evaluated coatings in years, but would do it according to J-STD-001C, Reqmnts
Electronics Forum | Thu Aug 20 14:52:40 EDT 2009 | davef
Armando: We're guessing that the white residue is on the laminate also. We believe that the residue has something to do with your low residue flux and water. It could be: * Water contamination in the flux. * Poor selection of preheat temperature that
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON